Alloy Enterprises has launched a game-changing liquid cold plate for Nvidia's H100 AI chip. This new thermal management system uses a unique manufacturing process that combines 3D modeling with laser-cut layers, enhancing heat dissipation. As AI computing power surges—predicted to hit 4,000 watts by 2034—better cooling solutions are more important than ever. This innovation may even trickle down to gamers, promising a cooler future for high-performance computing.
Published on: 8/30/2025
View the full content at Revolutionary Cooling Tech for AI Superchips